Digital/HDI PCBs
In the table below is a comprehensive list of Sunstone's key printed circuit board manufacturing capabilities.
In the table below is a comprehensive list of Sunstone's key printed circuit board manufacturing capabilities.
QUALITY STANDARDS
STAY UPDATED
From single-layer prototypes to complex multilayer production boards, ASC Sunstone's digital PCB capabilities cover the full range of standard and advanced designs, with one of the fastest online quoting systems in the industry.
Fastest turn for 1-14 layer boards (limited review)
Standard NRE turn for 1-20 layer boards
Maximum layer count supported
Certified manufacturing with Class iii and MIL Capability
Digital PCBs are the broad category of boards designed around logic, processing, power, and communication functions, as opposed to RF/microwave or analog designs. They range from simple two-layer boards to dense multilayer stackups with controlled impedance, embedded features, and advanced via structures.
ASC Sunstone builds digital boards across the full complexity spectrum: quick-turn prototypes that need to be in your hands tomorrow, pre-production builds for validation, and production-volume runs with full DFM review and electrical test. The same quoting system handles all of it, and most quotes come back in under two hours.
ASC Sunstone's online quoting system is designed to give you instant pricing, and our custom quote process can take up to 24 hours depending on complexity of the project.
FASTEST OPTION
Limited design review. Best for straightforward design where you've already run DFM checks and are confident in your files
COMPLEX DESIGNS
Non-recurring engineering review included. Covers advanced stackups, tight tolerances, and designs that benefit from a fabrication engineer's eyes before production
| Specification | Details |
|---|---|
| Layer count | 1–20 layers |
| Fastest lead time | 1-day turn (1–14 layers, limited review) |
| Standard NRE lead time | 2-day turn (1–20 layers) |
| Board shapes | Complex board shapes supported |
| Internal cutouts | Plated and non-plated internal cutouts available |
| Blind and buried vias | Supported |
| Via fill | Conductive and non-conductive fill available |
| Controlled impedance | Available |
| Edge plating | Supported |
| Lead-free compatibility | Available across all material types |
| DFM review | Available (included with NRE builds) |
| Electrical test | Available |
| Assembly | Available |
| Certifications | ISO certified, UL certified, Class III and MIL capable |
ASC Sunstone works with a broad range of digital laminate materials from established suppliers. Material selection depends on your operating temperature range, signal speed requirements, and whether lead-free assembly compatibility is needed.
Laminate suppliers include:
Not sure which material fits your design? The online quote form walks you through the options, and our team is available if you have questions before committing.
Standard FR-4 has a glass transition temperature (Tg) around 130–140°C. High Tg FR-4 typically runs 170°C or higher. If your board will be assembled with lead-free solder (which peaks around 260°C), experience high ambient operating temperatures, or go through significant thermal cycling in use, High Tg material offers better dimensional stability and reduced risk of delamination. Most designs targeting lead-free assembly benefit from it.
FR-4 works well for the majority of digital designs. But as data rates climb, generally above 5–10 Gbps depending on trace length, FR-4's loss tangent starts degrading signal integrity in ways that equalization and design tricks can only partially compensate for. Low-loss laminates like those from Isola and Nelco's high-speed lines give you better insertion loss performance and more consistent Dk, which matters for long traces, differential pairs, and backplane designs.
The 1-day option moves fast by doing minimal design review, it's best for designs you've already checked with DFM tools and are confident are buildable as-is. The 2-day NRE path includes a fabrication engineer reviewing your files before production starts. This catches stack-up issues, via clearance problems, or tolerance concerns that automated checks sometimes miss. For first-article or complex designs, the extra day is usually worth it.
Internal cutouts, slots or holes routed through the interior of the board, are used for things like connector clearance, component recessing, airflow, or mechanical mounting features. Non-plated cutouts are simply routed openings. Plated cutouts have copper on the inner walls, which can be used to create edge connections or improve shielding at the cutout perimeter. Both are supported digital builds
DFM (design for manufacturability) review checks whether your design can be built to spec within typical fabrication tolerances. Common issues caught include annular ring violations, minimum drill-to-copper spacing, trace width and spacing against the chosen process, impedance stack-up accuracy, solder mask coverage, and aspect ratio concerns on small-diameter vias. Catching these before the board goes into production saves the cycle time of a redesign spin.
Electrical test (net-list continuity and isolation testing) is available on all ASC Sunstone digital builds and can be added at the quote stage. For prototype quantities, it's a judgment call based on board complexity and your risk tolerance. For production quantities or safety-critical applications, it's strongly recommended, it catches opens and shorts that visual and AOI inspection alone can miss.