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Every board starts with a set of requirements, impedance targets, layer count, via strategy, material selection. The capabilities below are the technical disciplines ASC Sunstone applies to hit those requirements, from early stack-up decisions through fabrication. Browse by capability to see what's involved and where our engineers can help.
Stack-up design, trace geometry, and ±5% tolerance, verified by TDR coupon testing on every build.
Free up routing space with controlled-depth drilling and sequential lamination, built to your layer pairing.
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