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Every board starts with a set of requirements, impedance targets, layer count, via strategy, material selection. The capabilities below are the technical disciplines ASC Sunstone applies to hit those requirements, from early stack-up decisions through fabrication. Browse by capability to see what's involved and where our engineers can help.
Precise, repeatable impedance control for high-speed and RF designs where signal integrity can't drift.
Microvia structures that free up routing space and support tighter, denser layouts.
Engineered stackups that balance signal performance, manufacturability, and cost for your build.
A full range of laminates, from standard FR-4 to Rogers and Arlon, matched to your performance needs.
AS9100D, MIL-PRF-31032, and ITAR compliance built into every board we ship.
Full specs on layer counts, tolerances, and materials so you can confirm feasibility before you design.
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